TECHNOLOGY · INDUSTRIAL PHYSICAL AI

From Physics AI to
engineering intelligence

Semantic Graph connects industrial vision and sensing, Physics AI and digital twins, and Knowledge Graph/GraphRAG to support manufacturing decisions from physical evidence to prediction and explanation.

PINN · Scientific MLNVIDIA GPU · CUDAPhysicsNeMo EvaluationKnowledge Graph · GraphRAGx86 Physical AI ServerJetson · TensorRT (Selective Edge)
CORE ARCHITECTURE

Three-layer Physical AI architecture

We distinguish technologies used in current development from technologies planned for evaluation and expansion.

01 · PHYSICAL PERCEPTION

Industrial Vision & Sensing

AI vision, SWIR, thermal imaging, cameras, and process sensors capture physical conditions and inspection evidence.

02 · PHYSICS INTELLIGENCE

PINN · Physics AI · Digital Twin

Physics constraints, boundary conditions, CAE, and measured data support thermal/process prediction and surrogate models.

03 · ENGINEERING INTELLIGENCE

Knowledge Graph · GraphRAG

Lot, material, process, equipment, defect, and action knowledge supports evidence-grounded RCA and engineering decisions.

PHYSICS AI STACK

From PINNs to a Thermal Digital Twin

01 · PHYSICS

PDE · Boundary Conditions

Thermal equations, material properties, geometry, and boundary conditions define physics constraints.

02 · LEARNING

PINN · Neural Operator

Scientific Machine Learning complements CAE and sensor data with GPU-accelerated surrogate models.

03 · ACCELERATION

NVIDIA GPU · CUDA

Used in current AI development workloads. PhysicsNeMo remains a planned evaluation area.

04 · APPLICATION

HBM Thermal Twin

Targets temperature fields, hotspots, thermal resistance, reliability risk, and sensor-guided calibration.

MANUFACTURING KNOWLEDGE AI

Inspection evidence → RCA → engineering action

KNOWLEDGE GRAPH

Manufacturing Context

Connect inspection images with lot, material, process, equipment, and corrective-action history.

GRAPHRAG

Evidence-grounded Retrieval

Retrieve similar cases, SOPs, historical defects, and connected evidence paths for explainable RCA.

PHYSICAL AI DEPLOYMENT

x86 Server + Selective Edge

Use x86_64 GPU servers as the primary operating platform, adding Jetson Orin/TensorRT only for validated low-latency inference close to industrial cameras and sensors.

NVIDIA GPU and CUDA are used in current development. PhysicsNeMo and Omniverse/OpenUSD are evaluation/roadmap technologies. This page does not claim NVIDIA Inception membership or a formal NVIDIA partnership.
TECHNOLOGY & IP ROADMAP · PRELIMINARY

Patent themes and differentiation logic

A preliminary prior-art review indicates that generic PINN thermal prediction, digital twins, knowledge-graph RCA, and closed-loop optimization already have related art. Our IP strategy therefore focuses on manufacturing-specific combinations and validation logic.

PRIORITY 1

Adaptive Physics-Informed Thermal Digital Twin for HBM Packaging

Packaging-specific multi-fidelity calibration across geometry, materials, power, boundary conditions, thermal sensors, CAE/PINN residuals, hotspot and thermal-resistance prediction, plus model validity checks.

PRIORITY 2

Physics-Evidence Graph for Explainable Defect RCA

Align AI Vision, SWIR, thermal sensors, lot/equipment/process data, and physics residuals in a causal/knowledge graph to generate evidence paths for root-cause candidates.

PRIORITY 3

Closed-Loop Physical AI with Verified Engineering Actions

Generate process-adjustment candidates with GraphRAG/AI agents, validate safety and physics consistency in a digital twin, then route only validated actions for engineer approval.

This is a preliminary technology/IP roadmap, not a patent filing or freedom-to-operate opinion. Novelty, inventive step, claim scope, and FTO require separate professional review before filing.

Discuss a technical fit

We review HBM Thermal Digital Twin, SWIR inspection, GraphRAG, x86 Physical AI Server, and selective edge-deployment opportunities.